Effects of α, ω-Diphenylazophenoxy Polyethylene Glycol on Copper Deposition
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- SUGIMOTO Masaharu
- Kanto Gakuin University Surface Engineering Research Institute
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- MATSUBARA Toshiaki
- Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
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- HONMA Hideo
- Kanto Gakuin University Surface Engineering Research Institute Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
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- KOUZAI Hiroaki
- Kanto Gakuin University Surface Engineering Research Institute Department of Applied Material and Life Science, College of Engineering, Kanto Gakuin University
Bibliographic Information
- Other Title
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- Effects of α,ω-diphenylazophenoxy polyethylene gIycol on copper deposition
- Effects of a o diphenylazophenoxy polyethylene gIycol on copper deposition
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Abstract
This paper describes the effects of polyethylene glycol (PEG) derivatives on copper electroplating. α, ω-Diphenylazophenoxy polyethylene glycol (PEG-Az) of the novel PEG derivative provides interesting results, suppressing copper deposition during copper electroplating. We found that PEG-Az suppresses copper deposition without the chlorideion (Cl-ion). To determine the reason for this action, we carried out linear sweep voltammetry (LSV), glow discharge optical emission spectroscopy (GDOES), and electrochemical quartz crystal microbalance (EQCM) measurements for the plating bath containing PEG-Az. PEG-Az was found to be a stronger suppression effect than the PEG even without the Cl-ion.
Journal
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- Journal of Materials Life Society
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Journal of Materials Life Society 19 (3), 132-135, 2007
MATERIALS LIFE SOCIETY, JAPAN
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Details 詳細情報について
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- CRID
- 1390001204339284608
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- NII Article ID
- 10019740863
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- NII Book ID
- AA11583427
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- COI
- 1:CAS:528:DC%2BD2sXhtFOgsbbI
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- ISSN
- 21857016
- 13460633
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- NDL BIB ID
- 8914921
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- CiNii Articles
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- Abstract License Flag
- Disallowed