Measurement of Residual Stress in the Electrical Ceramics/Metal Joint.

DOI IR HANDLE Web Site

Bibliographic Information

Other Title
  • 導電性セラミックス／金属接合体の残留応力測定
  • ドウデンセイ セラミックス キンゾク セツゴウタイ ノ ザンリュウ オウリョク ソクテイ

Search this article

Abstract

Electrical Sialon ceramics having some contents of TiN and SKS3 metal were joined with Ag-Cu-Ti active brazing metal layer having a thickness of 100μm or 400μm at a temperature of 1113K for 300s in a vacuum. The residual stresses on the brazed joint samples were measured in the ceramics side and the metal side by X-ray stress analysis. The linearity in 2θ-sin2 φ diagram was confirmed for X-ray diffraction from the grinded surfaces of metal and ceramics. The residual stresses in the ceramics and metal sides of brazed joint samples indicated the characteristic distributions each other. The residual stress over several hundred MPa was measured within about 10mm from the joint interface in the metal side of brazed joint sample. The 400μm thickness of the brazing metal layer was especially effective to relax the residual stress of σy in the ceramics side (σy: residual stress in vertical direction to the joint interface). And when the brazing metal layer thickness was 400μm, the residual stress σy in the metal side showed almost zero value due to the plastic deformation of the brazing metal layer.

Journal

Keywords

Details 詳細情報について

Report a problem

Back to top