Misorientation and Surrounding-Atmosphere Dependence of Ductility at High Temperatures of Cu Bicrystals with Dispersed SiO2 Particles.

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  • 分散強化Ｃｕ‐ＳｉＯ２合金双結晶の高温延性に及ぼす粒界方位差とガス雰囲気の影響
  • ブンサン キョウカ Cu-SiO2 ゴウキンソウケッショウ ノ コウオン エン

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Abstract

Orientation-controlled Cu bicrystals with disperesed SiO2 particles were tensile tested at various temperatures in vacuum and Ar-gas atmospheres. Two kinds of bicrystals having [001] twist 12°and 30°grain boundaries were employed. 30°bicrystal specimens fractured intergranularly at around the intermediate-temperature range, although 12°ones fractured transgranularly at all the temperatures. The elongation to fracture was smaller when deformed in Ar atmosphere than in vacuum almost at all the temperatures irrespective of the bicrystal specimens. The above results could be reasonably understood by considering the difference of the mean grain-boundary strength, the inherent grain-boundary strength, and the effect of gas atmosphere which would be responsible for the acceleration of void formation and growth.

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