書誌事項
- タイトル別名
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- Elastic-Creep Finite Element Analysis of Solder Joints and Experimental Verification Using a Diffused Type Strain Gauge.
- ハンダ セツゴウブ ノ ダンセイ クリープ ユウゲン ヨウソ カイセキ ト カ
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抄録
In this study, first, tensile and creep tests were carried out on two solders, 63 Sn-37 Pb and 95 Pb-5 Sn, to determine their mechanical properties. Using the measured properties, constitutive equations for the solders based on elasticity and creep were formulated. Next, an elastic-creep finite element analysis was performed on solder joint structures under thermal cycle. The solder joint structure consisted of a Si chip and a Cu plate with either 63 Sn-37 Pb or 95 Pb-5 Sn solder. The validity of the analysis was verified by the experiment using a diffused type strain gauge formed on the Si chip. The analytical results of the thermal stress on the Si chip were in good agreement with the experimental results. The analytical results showed that most of the creep strain in the solder joints occurred during the temperature change, the temperature change time hardly affected the creep strain range in solder joints, and the creep strain range for 95 Pb-5 Sn solder was higher than that for 63 Sn-37 Pb solder.
収録刊行物
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- 日本機械学会論文集A編
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日本機械学会論文集A編 64 (619), 703-708, 1998
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001204447306496
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- NII論文ID
- 110002374487
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- NII書誌ID
- AN0018742X
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- ISSN
- 18848338
- 03875008
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- NDL書誌ID
- 4434624
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可