書誌事項
- タイトル別名
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- Development of Wafer Level Chip Size Packaging Process and its Application to the CMOS Image Sensor Module for Medical Device
- イリョウヨウ CMOS サツゾウ モジュール エ ノ オウヨウ オ メザシタ サツゾウ ソシ WL-CSP プロセス ノ カイハツ
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<p>A new packaging technique has been realized and applied to the imaging module for medical endoscope. In order to realize minimal invasiveness for in-vivo medical device applications, the WL-CSP (Wafer Level-Chip Size Package) is one of the most attractive technology. However, in the field of medical device packaging, the packaging needs are diversified and required number of each package does not meet the huge sized wafer processing. In this new technique, the CMOS image sensor wafer is diced at first, and then individual image sensor chips are rearranged on another smaller handling wafer. As a result, suitable size of the handling wafer can be selected for the production volume, and lower production cost and shorter production lead time can be achieved. The packaged image sensor with new packaging technique showed no significant degration of charactristic of image sensor.</p>
収録刊行物
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- 電気学会論文誌E(センサ・マイクロマシン部門誌)
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電気学会論文誌E(センサ・マイクロマシン部門誌) 137 (2), 48-58, 2017
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390001204460051840
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- NII論文ID
- 130005306513
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 027967107
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可