Underfill Parameter Optimization Study for Mobile Products with Numerical Analysis
-
- Nakanishi Tohru
- IBM Japan, Ltd. Yokohama
-
- Shundoh Yoshimune
- ThreeBond Tokyo
-
- Kuboyama Toshifumi
- ThreeBond Okayama
この論文をさがす
抄録
We reported on a numerical analysis of the material properties that directly control the quality of the analytic results in our previous paper. In this paper, we focus on parameter optimization for the underfill in high density products such as consumer electronics devices. We report on our methodology to optimize the underfill properties through some parameter studies with numerical analysis.<br>It is difficult to select the best underfill to be used for the high density packaging. In this study, some currently available underfills and a newly developed one are used in wafer level chip-sized package technology to compare the reliability of the packages against the stress and strain caused at both solder and underfill under thermal stress.
収録刊行物
-
- 電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）
-
電気学会論文誌Ｅ（センサ・マイクロマシン部門誌） 130 (8), 383-387, 2010
一般社団法人 電気学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390001204461011712
-
- NII論文ID
- 10026498215
-
- NII書誌ID
- AN1052634X
-
- ISSN
- 13475525
- 13418939
-
- NDL書誌ID
- 10765392
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
-
- 抄録ライセンスフラグ
- 使用不可