Au-Electrode-Embedded Cyclo-Olefin Polymer Microchip Using Low-Temperature Direct Bonding
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- Shinohara Hidetoshi
- School of Fundamental Science and Engineering, Waseda University
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- Mizuno Jun
- Nanotechnology Research Laboratory, Waseda University
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- Shoji Shuichi
- School of Fundamental Science and Engineering, Waseda University
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A simple fabrication method of Au-electrode-embedded cyclo-olefin polymer (COP) microchip was developed using hot embossing, Au wet etching and low-temperature direct bonding methods. A prototype microchip (dimension: 20 × 40 mm2) was fabricated. The Au electrode coated by electron-beam evaporation was successfully patterned on COP surface without any intermediate metal layers. The adhesion strength between the COP and the Au film was stronger than the strength between quartz and Au, and as same as between Si and Cr. The bond strength between the COP and Au coated on COP plate was strong enough not to leak flow of de-ionized water at the bonded interfaces. Flow behavior of negative-charged fluorescent microbeads indicates that the electrical continuity of Au electrode was kept after the bonding process. This technology is remarkable advantage of integrating electrode in plastic microchips.
収録刊行物
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- 電気学会論文誌Ｅ（センサ・マイクロマシン部門誌）
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電気学会論文誌Ｅ（センサ・マイクロマシン部門誌） 130 (8), 347-350, 2010
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390001204461041280
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- NII論文ID
- 10026498119
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 10765347
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可