Coupled Electro-Thermal Analysis of the Micro Flow Sensor with Control Circuit using SPICE

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  • Kamiunten Shoji
    Tokyo University of Science, Department of Mechanical Engineering Yamatake Corporation, Micro Device Department
  • Nagayo Hidetomo
    Tokyo University of Science, Department of Mechanical Engineering
  • Motosuke Masahiro
    Tokyo University of Science, Department of Mechanical Engineering
  • Honami Shinji
    Tokyo University of Science, Department of Mechanical Engineering

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Other Title
  • マイクロフローセンサと制御回路のＳＰＩＣＥを用いた電気‐熱　連成解析
  • マイクロフローセンサと制御回路のSPICEを用いた電気-熱 連成解析
  • マイクロ フロー センサ ト セイギョ カイロ ノ SPICE オ モチイタ デンキ ネツ レンセイ カイセキ

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This paper reports an electro-thermal analysis of two-element Micro Flow Sensor (MFS). The measurement principle is based on temperature difference between upstream and downstream part of electrically connected heating-sensing elements. The two-heater MFS, the thermal fluid flow around MFS and the electric circuit were modeled together using a commercial general-purpose circuit simulator based on SPICE (Simulation Program with Integrated Circuit Emphasis). The model has a partial three-dimensional lumped thermal network model involved in a two-dimensional one. Two-dimensional laminar Poiseuille channel flow was assumed as the flow field in the model, and the forced convective heat transfer was calculated by energy balance at each node in the fluid flow. The tendency on the sensor characteristics was in good agreement between the simulation and experiment.

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