Improve the Adhesive Strength of the Leadframe and Epoxy Resin by Forming of Organic Molecules-metal Composite Interface

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  • Furuno Ryota
    Mitsui High-tec, Inc. Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology
  • Takatuji Yoshiyuki
    Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology
  • Kubo Kimihiko
    Mitsui High-tec, Inc.
  • Haruyama Tetsuya
    Department of Life Science and Systems Engineering, Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology

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Other Title
  • 有機分子-金属複合界面の形成によるリードフレームとエポキシ樹脂の接着強度向上
  • ユウキ ブンシ-キンゾク フクゴウ カイメン ノ ケイセイ ニ ヨル リードフレーム ト エポキシ ジュシ ノ セッチャク キョウド コウジョウ

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Abstract

Delamination in semiconductor plastic package is a cause of reliability degradation. We have tried to improve the adhesion strength between leadframe and epoxy resin. In this study, organic molecules-metal (Cu) complex “EC tag (Cu)” were employed. It is immobilized on the leadframe surface as adhesion promoter to adhere with thermosetting epoxy resin. In the results, immobilized EC tag (Cu) act as adhesion promoter that shows greater adhesion between leadframe and epoxy resin. Also the leadframe with adhesion promoter doesn't affect semiconductor assembly characteristics.

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