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- Toan Nguyen Van
- Graduate School of Engineering, Tohoku University Microsystem Integration Center (µSIC), Tohoku University
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- Toda Masaya
- Graduate School of Engineering, Tohoku University Microsystem Integration Center (µSIC), Tohoku University
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- Kawai Yusuke
- Graduate School of Engineering, Tohoku University
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- Ono Takahito
- Graduate School of Engineering, Tohoku University
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This paper presents a long bar type silicon resonator with a high quality (Q) factor and an evaluation of the hermetic packaged device. This research aims at developing the integration technology of the capacitive silicon resonator on LSI for application of a timing device. The structure of the silicon resonator is defined by deep reactive ion etching of the top Si layer of a silicon on insulator wafer, and then the patterned top Si layer is transferred onto a low temperature co-fired ceramic substrate. Fabricated resonator is hermetically sealed by anodic bonding technique. The resonator is excited in the extensional bulk acoustic mode at a resonant frequency of 9.69 MHz. The Q factor measured for this device is approximately 368,000 at vacuum chamber pressure of 0.01 Pa. Additionally, the dependence of the Q factor on the operating pressure is measured in order to evaluate the vacuum level of the hermetically packaged device.
収録刊行物
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- 電気学会論文誌E(センサ・マイクロマシン部門誌)
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電気学会論文誌E(センサ・マイクロマシン部門誌) 134 (2), 26-31, 2014
一般社団法人 電気学会
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詳細情報 詳細情報について
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- CRID
- 1390001204462282496
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- NII論文ID
- 130003391578
- 40019981452
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- NII書誌ID
- AN1052634X
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- ISSN
- 13475525
- 13418939
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- NDL書誌ID
- 025276925
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- NDL
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- KAKEN
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- 使用不可