Proposal of High-Density Packaging Construction and Conductive Pattern Forming Method on Vertical Wall Using Spray Coating Technology
-
- Morii Hiroki
- Department of I.M.S.E, Kagawa University
-
- Oohira Fumikazu
- Department of I.M.S.E, Kagawa University
-
- Suzuki Takaaki
- Department of I.M.S.E, Kagawa University
-
- Terao Kyohei
- Department of I.M.S.E, Kagawa University
-
- Sasaki Minoru
- Toyota Technological Institute
-
- Ochi Toshihiko
- AOI Electronics co., Ltd.
-
- Yuzuriha Asumi
- AOI Electronics co., Ltd.
-
- Wani Katsuhito
- U-mic. Co., Ltd.
この論文をさがす
抄録
A novel packaging construction is newly proposed for the high-density packaging, and the three dimensional conductive pattern forming method on the vertical wall is developed and applied for the packaging. For this purpose, the spray coating and the angled exposure pattern forming technologies are examined to the vertical side wall of 600 μm height, and then the characteristics of the formed pattern are evaluated. As the result, the conductive patterns of 200 μm width and 300 μm spacing could be successfully formed on the vertical walls. The measured resistance of the pattern is within one ohm which is sufficient for the conductive wiring. The reliability of the chip package with the conductive pattern was also evaluated, and it was shown that the patterns formed by the proposed method satisfy the fundamental reliability characteristics.
収録刊行物
-
- 電気学会論文誌E(センサ・マイクロマシン部門誌)
-
電気学会論文誌E(センサ・マイクロマシン部門誌) 131 (1), 40-44, 2011
一般社団法人 電気学会
- Tweet
詳細情報 詳細情報について
-
- CRID
- 1390001204462352640
-
- NII論文ID
- 10027637493
-
- NII書誌ID
- AN1052634X
-
- ISSN
- 13475525
- 13418939
-
- NDL書誌ID
- 10934939
-
- 本文言語コード
- en
-
- データソース種別
-
- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
-
- 抄録ライセンスフラグ
- 使用不可