Effect of Die Material on Moldability of Sub-μm Structure with Injection Molding

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  • 型材料が射出成形によるサブミクロン構造創製に与える影響
  • カタザイリョウ ガ シャシュツ セイケイ ニ ヨル サブミクロン コウゾウ ソウセイ ニ アタエル エイキョウ

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The moldability of sub-μm structure was investigated by the injection molding at injection rates of 74, 186 and 3905mm/sec into 4 typed dies; SKD 11, WC/Co, Ni and DLC coated SKD 11. The moldability for SKD 11, WC/Co and Ni dies increased with increasing injection rate. On the contrary, the moldability for the DLC coated die, which is low polar component of the surface energy, slightly decreased with increasing injection rate. It is suggested that polar component of the surface energy influences to the moldability. Focused on the moldability for DLC with COP, which is one of non polar component materials, was significantly larges at the slow injection rate, and it is indicatied that the friction coefficient of DLC was more effected than that of the spreading coefficient to the moldability of DLC.

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