書誌事項
- タイトル別名
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- In-situ Thermal Stress Measurement in Multi-layered Aluminum Nitride and Copper Films by Synchrotron Radiation
- ホウシャコウ オ モチイタ チッカ アルミニウム ドウ セキソウマク ノ ネツ オウリョク ソノバ ソクテイ
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説明
The specimen prepared in this study was multi-later aluminum nitride and copper films deposited on thermal oxidation silicon by dc sputtering. Thermal stresses in the copper layers were investigated by ultra high X-rays of synchrotron radiation in the heating and cooling process. It found from the sin2 ψ diagrams of the multi-layered film that the copper layers consisted of crystal grains which had two different orientations. One was randomly orientation, and the other was {111} orientation. The FWHM of the diffraction from the {111} -oriented crystal grains was constant regardless of heating temperature. On the other hand, the FWHM of the diffraction from the randomly-oriented crystal grains was decreased with increasing heating temperature at 1st heating cycle and it became constant regardless of heating temperature after the 1st heating cycle. The 2θ-sin2 ψ diagrams of the multi-layered film for the stress measurement showed non-linear. We could obtain thermal stresses in two different orientation crystal grains from the non-linear 2θ-sin2 ψdiagram at same time. For both crystal grains, the thermal stress differences between the 1st heating and the 1st cooling cycles were shown as a hysteresis loop. In the case of the 2nd thermal cycles, the thermal stresses changed linearly for both crystal grains. For the 1st heating cycle, the compressive thermal stress in the {111} -oriented crystal grains was larger than that in the randomly-oriented one.
収録刊行物
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- 日本機械学会論文集Ａ編
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日本機械学会論文集Ａ編 74 (739), 363-369, 2008
一般社団法人 日本機械学会
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詳細情報 詳細情報について
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- CRID
- 1390001204479313408
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- NII論文ID
- 110006643459
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- NII書誌ID
- AN0018742X
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- COI
- 1:CAS:528:DC%2BD1cXntValurk%3D
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- ISSN
- 18848338
- 03875008
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- NDL書誌ID
- 9437902
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
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- 抄録ライセンスフラグ
- 使用不可
