銅めっき応力測定法への画像処理の応用

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  • The application of computer image processing to stress measurement by copper electroplating.
  • ドウ メッキ オウリョク ソクテイホウ ヘ ノ ガゾウ ショリ ノ オウヨウ

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An image processing system using a personal computer was applied to stress measurement by copper electroplating. The microscopic TV image of the plating structure of an electroplated specimen after being cyclically loaded was directly analyzed by the image processing system, and grain density in the plating layer was measured automatically. The surface stress of the specimen can be estimated based on the grain density. The stress concentration factor of grooved shafts under torsion was obtained as an example of the application of this system. The result was in good agreement with the numerical values published previously.

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