Effective Features for Defective Soldering Detection by Image Analysis

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  • 画像解析によるはんだ付け外観検査のための有効特徴量の調査
  • ガゾウ カイセキ ニ ヨル ハンダズケ ガイカン ケンサ ノ タメ ノ ユウコウ トクチョウリョウ ノ チョウサ

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Abstract

In the optical soldering inspection systems, the existence or nonexistence of soldering paste and unfirm solder are relatively easy to be detected. However, it is difficult to classify the amount, the shape and the state of the fillet of brazed joints. This study aims at a development of an automatic classification system of solder joints on printed circuit boards and an exploration of effective features for defective soldering detection by means of statistical image analysis of digital images. A number of features are selected from textural features to be tested for the classification into 5 typical classes of solder joints. Experiments have shown that they are effective.

Journal

  • ITE Technical Report

    ITE Technical Report 33.31 (0), 5-8, 2009

    The Institute of Image Information and Television Engineers

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