ＡｕとＩｎ‐Ｓｎ系はんだの界面における金属間化合物成長過程

荘司 郁夫, 藤原 伸一, 清野 紳弥, 藤井 俊夫, 小林 紘二郎

doi:10.5104/jiep.2.121

書誌事項

タイトル別名

Growth Kinetics of Intermetallic Compounds on the Boundary between Au and In-Sn Alloys.
Au ト In-Snケイハンダノカイメンニオケルキンゾクカンカゴウブツセイチョウカテイ

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説明

The growth kinetics of intermetallic compounds formed on the boundary between Au and In-Sn alloy solders were investigated with Au/Sn-27In and Au/Sn-20In diffusion couples. On annealing under the melting point of each solder, the Au-In intermetallic compound layers, such as AuIn₂, Au₇In₃ and AuIn, were firstly formed on the boundary. More continuous annealing caused the formation of Au-Sn intermetallic compound layers on the boundary and the Au₇In₃ and AuIn layers were disappeared at the same time. On the other hand, it was found the Au-Sn compound layers were already formed on the boundary by annealing for 60s at 523K, which temperature is over the melting point of both solders.

収録刊行物

エレクトロニクス実装学会誌

エレクトロニクス実装学会誌 2 (2), 121-126, 1999

一般社団法人エレクトロニクス実装学会

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詳細情報詳細情報について

CRID: 1390001204559703296

NII論文ID: 130004062787; 110001238691

NII書誌ID: AA11231565

DOI: 10.5104/jiep.2.121

ISSN: 1884121X; 13439677

NDL書誌ID: 4653734

Web Site: http://id.ndl.go.jp/bib/4653734; https://ndlsearch.ndl.go.jp/books/R000000004-I4653734; http://www.jstage.jst.go.jp/article/jiep1998/2/2/2_2_121/_pdf

本文言語コード: ja

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