Crystallographic Observation for Au/Au Bond Interface by Ultrasonic Bonding

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  • Sogawa Mitsuomi
    Graduate Student, Graduate School of Engineering, Kyushu Institute of Technology
  • Otsubo Fumitaka
    Graduate School of Engineering, Kyushu Institute of Technology
  • Yamaguchi Tomiko
    Graduate School of Engineering, Kyushu Institute of Technology
  • Nishio Kazumasa
    Graduate School of Life Science and Systems Engineering, Kyushu Institute of Technology
  • Era Hidenori
    Graduate School of Engineering, Kyushu Institute of Technology

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Other Title
  • 超音波接合によるＡｕ／Ａｕ界面の結晶組織観察
  • チョウオンパ セツゴウ ニ ヨル Au Au カイメン ノ ケッショウ ソシキ カンサツ

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A crystallography study and observation of microstructure were carried out on the joint of an Au ball and Au electrode formed using two modes of ultrasonic bonding which show differences under the life test. A non-bonded joint was seen on the samples using SEM observation. Also, it was found that the length of bonding of the LP sample, which was bonded using low ultrasonic output, was short compared with that of the HP sample, which was bonded using high ultrasonic output. From an analysis of the IPF image obtained using EBSD, the interface of the joint in the LP sample apparently retained the crystal orientation of the interface before bonding. However, {001} in the HP sample, the crystal grain formed parallel to the bonded plane in the newly formed large area without obvious interface from the joint. It was concluded from this that the crystal grain having the same axis as the Au ball formed in the Au electrode though the orientation was not obvious from SEM and TEM observation.

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