Current Topics in the Field of Design under Electromagnetic Consideration
Bibliographic Information
- Other Title
-
- エレクトロニクス実装技術の現状と展望 電磁特性分野の現状と展望
- デンジ トクセイ ブンヤ ノ ゲンジョウ ト テンボウ
Search this article
Journal
-
- Journal of The Japan Institute of Electronics Packaging
-
Journal of The Japan Institute of Electronics Packaging 10 (1), 8-10, 2007
The Japan Institute of Electronics Packaging
- Tweet
Details 詳細情報について
-
- CRID
- 1390001204560118400
-
- NII Article ID
- 110006151991
-
- NII Book ID
- AA11231565
-
- ISSN
- 1884121X
- 13439677
-
- NDL BIB ID
- 8646034
-
- Text Lang
- ja
-
- Data Source
-
- JaLC
- NDL
- Crossref
- CiNii Articles