Extraction of Solder Constituent from CSP Boards by Means of X-ray Energy Subtraction Method.

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  • TERAMOTO Atsushi
    Opt-Electronics Div., Nagoya Electric Works Co., Ltd.
  • HORIBA Isao
    Faculty of Information Science and Technology. Aichi Prefectural University

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Other Title
  • Ｘ線エネルギサブトラクションによるＣＳＰ実装基板のはんだ成分抽出
  • Xセン エネルギサブトラクション ニ ヨル CSP ジッソウ キバン ノ ハンダ セイブン チュウシュツ

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With the high requirement of high-density packaging, CSP have been spread widely. To inspect the solder joint in CSP, an X-ray image has been used. However, an X-ray image contains not only solder joint but also capper leads. Therefore, it is very difficult to analyze the solder with robustness. In this paper, we propose a new method for extracting the solder constituent by means of Energy Subtraction. In the experience, we compared the performance of thick measurement between regular X-ray Image and Subtraction image. The result shows the advantageous performance of Subtraction method over regular one.

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