Measurement of Local Two Dimensional Stress Distribution in a Flip Chip Structure by Using Strain Sensor Chips with 2-.MU.m Long Piezoresistance Gauges
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- Sasaki Takuya
- Department of Nanomechanics, Graduate School of Engineering, Tohoku University
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- Ueta Nobuki
- Department of Nanomechanics, Graduate School of Engineering, Tohoku University
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- Miura Hideo
- Fracture and Reliability Research Institute, Tohoku University
Bibliographic Information
- Other Title
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- ピエゾ抵抗ひずみセンサを用いたフリップチップ実装構造内局所２軸残留応力分布の測定
- ピエゾ テイコウヒズミ センサ オ モチイタ フリップチップ ジッソウ コウゾウ ナイキョクショ 2ジク ザンリュウ オウリョク ブンプ ノ ソクテイ
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Abstract
Complicated local distribution of residual stress and strain occurs in flip-chip structures due to the difference in material properties such as the coefficients of thermal expansion and elastic modulus among metallic bumps, underfill material, the silicon chip and the substrate. The residual stress was measured using newly-developed strain sensor chips with 2-μm long piezoresistance gauges. As a result of three dimensional analyses and the experiment, it was found that the amplitude of the residual stress in the stacked chips reached about 300 MPa. In addition, both isotropic and anisotropic normal stress fields appeared locally on the chip surface depending on the bump alignment. The magnitude of the difference in the anisotropic residual normal stress reached 150 MPa.
Journal
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- Journal of The Japan Institute of Electronics Packaging
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Journal of The Japan Institute of Electronics Packaging 12 (7), 623-628, 2009
The Japan Institute of Electronics Packaging
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Details 詳細情報について
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- CRID
- 1390001204560617984
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- NII Article ID
- 110007465806
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- NII Book ID
- AA11231565
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- COI
- 1:CAS:528:DC%2BD1MXhsFahtLnK
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- ISSN
- 1884121X
- 13439677
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- NDL BIB ID
- 10486789
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
- KAKEN
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- Abstract License Flag
- Disallowed