書誌事項
- タイトル別名
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- Prevention of Metal Cohesive Particles in Conductive Plastics Distributed Pb-Free Solder.
- ナマリ フリー ハンダ ブンサン ドウデンセイ プラスチック ニ オケル キンゾク ギョウシュウリュウ ボウシ タイサク
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説明
Metal particles are found to form in conductive plastics when Pb-free solder is used. Once formed, these metal particles remain even if the kneading conditions are changed. As this impairs circuit formation of thin wires considerably during injection molding, the ways of preventing the formation were studied. Experiment results clarified that two types of metal particles are formed; those that are formed when nickel powder is used as the dispersal agent and the other type is the small metal particle which is formed slightly at a certain condition when copper powder is used. We then performed experiments to clarify the causes of the formation of these particles and how to prevent formation, and succeeded in preventing the formation completely.
収録刊行物
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- エレクトロニクス実装学会誌
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エレクトロニクス実装学会誌 2 (5), 385-389, 1999
一般社団法人エレクトロニクス実装学会
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詳細情報 詳細情報について
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- CRID
- 1390001204560766848
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- NII論文ID
- 130004165729
- 110001238756
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- NII書誌ID
- AA11231565
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- ISSN
- 1884121X
- 13439677
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- NDL書誌ID
- 4824650
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDLサーチ
- Crossref
- CiNii Articles
- OpenAIRE
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- 抄録ライセンスフラグ
- 使用不可
