Electroless Pattern Copper Plating on PET Film Using Nano-Dispersion of Polypyrrole

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  • Ashizawa Hiroki
    R&D Head Office, Achilles Corporation
  • Kato Shin-ichiro
    Department of Chemistry and Chemical Biology, Graduate School of Engineering, Gunma University
  • Nakamura Yosuke
    Department of Chemistry and Chemical Biology, Graduate School of Engineering, Gunma University

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  • ポリピロールナノ分散液を用いたPETフィルム上への無電解パターン銅めっき
  • ポリピロールナノ ブンサンエキ オ モチイタ PET フィルム ジョウ エ ノ ムデンカイ パターン ドウメッキ

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We studied electroless copper plating with a nanodispersion of polypyrrole using the loss of oxidation-reduction ability of polypyrrole by UV irradiation as a method of pattern plating on PET film. Using this method, palladium catalysts are only adsorbed onto the polypyrrole sites where there is no UV irradiation, resulting in the formation of pattern plating. Examining the irradiation conditions indicates that UV irradiation with wavelengths shorter than 300 nm is effective for the degradation of polypyrrole and copper was not deposited when the polypyrrole surface resistivity is higher than 1012 Ω/□. In pattern UV-irradiation for polypyrrole, the introduction of a reduction process where palladium ions (Pd2+) are reduced to zero-valent palladium (Pd) after catalyzing removed a small amount of residual palladium at the UV-irradiation sites and then allowed suitable pattern plating. In summary, this method can easily accomplish direct pattern plating on PET films.

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