銀を用いた触媒の特性とプリント配線板への応用

DOI Web Site Web Site 被引用文献6件 参考文献12件

書誌事項

タイトル別名
  • The Characteristics of the New Catalyst Which Used Silver and the Application to the Printed Circuit Board.
  • ギン オ モチイタ ショクバイ ノ トクセイ ト プリント ハイセンバン エ ノ オウヨウ

この論文をさがす

説明

We developed a new catalyst of silver, and examined the characteristics. The silver catalyst was synthesized without expensive palladium and without tin which becomes a catalytic poison. Therefore, the silver catalyst had various characteristics which are different from usual Pd-Sn catalyst. As applying the silver catalyst to the printed circuit board, the superiority of this catalyst became conspicuous. The adsorption-ability and the electroless copper plating deposition-ability of this catalyst were almost equal to those of Pd-Sn catalyst. Moreover, it was proved that most of the adsorbed silver catalyst dissolved in the copper foil etching process during circuit forming of the printed circuit board. As a result, the decrease in the insulation resistance value between the circuits and the deposition over the areas on which no deposition is required (the bridge and so on) can be prevented by using the silver catalyst.

収録刊行物

被引用文献 (6)*注記

もっと見る

参考文献 (12)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ