ナノおよびマイクロフィラーが添加されたエポキシ樹脂コンポジットにおける力学緩和と誘電緩和の相関

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タイトル別名
  • Correlation between Mechanical and Dielectric Relaxation Processes in Epoxy Resin Composites with Nano- and Micro-fillers
  • ナノ オヨビ マイクロフィラー ガ テンカ サレタ エポキシ ジュシ コンポジット ニ オケル リキガク カンワ ト ユウデン カンワ ノ ソウカン

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Effects of addition of nano-sized and micro-sized fillers into epoxy resin on its mechanical and dielectric relaxation phenomena were examined. The glass transition temperature (Tg) decreases when a small content of nanoclay modified by octadecylamine was added, while the decrease in Tg is suppressed when the nanoclay was modified by dimethyldodecylamine. On the other hand, Tg increases when microsilica was added abundantly. At temperatures above Tg, both mechanical and dielectric relaxations are accelerated in samples with octadecylamine-modified nanoclay, while the acceleration does not occur in samples with nanoclay modified by dimethyldodecylamine. Both relaxations are restricted in composites with abundant microsilica. Therefore, co-addition of dimethyldodecylamine-modified nanoclay and abundant microsilica is adequate in order to make an epoxy resin composite with a high Tg and low dielectric loss.

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