各種無電解めっき電極の耐イオンマイグレーション性能

DOI Web Site Web Site 参考文献14件
  • 今野 大
    Department of Electrical and Electronic Engineering, Graduate School of Engineering and Resource Science, Akita University
  • 水戸部 一孝
    Department of Electrical and Electronic Engineering, Graduate School of Engineering and Resource Science, Akita University
  • 藤村 和由
    Azuma Denka Industry Co., Ltd.
  • 鈴木 雅史
    Department of Electrical and Electronic Engineering, Graduate School of Engineering and Resource Science, Akita University
  • 吉村 昇
    Akita University

書誌事項

タイトル別名
  • Ion-Migration Resistance Characteristics of Various Electroless Plating Electrodes
  • カクシュ ムデンカイメッキ デンキョク ノ タイイオンマイグレーション セイノウ

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抄録

In this study, ion-migration (IM) endurance of the electroless plating to the electrodes was evaluated by the water drop test (WDT) method. The characteristics of the top layer metal affected the durability of IM when different types of metals were laminated in the plating process. After WDT, dendrites were found on the printed wiring board (PWB) with the electroless plating of Ag, but they were absent with electroless plating of Au, Pd or Ni of the top layer of an electrode. From the result, it is clear that the plating process of Au, Pd and Ni at the top layer of an electrode can improve the IM endurance. Moreover, the risk of metal elution increases with the electrical field concentration at electrode edge. Therefore, even if the surface of electrode was covered with excellent IM endurance metal, the IM endurance may decrease greatly if inferior IM tolerance metal was slightly exposed at the electrode edge.

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