Patterning of Metal Films by Laser lift-off Method and the Simulation

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  • レーザリフトオフによる金属薄膜のパターニングとシミュレーション
  • レーザ リフト オフ ニ ヨル キンゾク ハクマク ノ パターニング ト シミュレーション

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Abstract

For submicron size device application, the selective laser lift-off using the heat insulation of hydrocarbon film was applied to the patterning of metal thin film. Experimentally, Ni and Cu films were patterned on Si substrates and Pt films were patterned on fused quartz substrates, successfully. For clarifying the mechanism, temperature simulations were carried with for the present laser lift-off technique. As a result, in the laser lift-off process, the temperature of the metal layer did not reach the melting or vaporization point while the temperature of the hydrocarbon layer was found to be elevated above 250℃. These findings require a new mechanism including the vaporization or explosive phenomenon of hydrocarbon layer other than the simple metal evaporation model. In addition, it was found that a temperature characteristic was more suitable for a Si substrate than a fused quartz substrate by a simulation that considered reflectance.

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