Development of Emulsionized Developer of Solder Resists for Printed Wiring Boards.

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  • ソルダレジスト用エマルション現像液の開発

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We have developed a novel developer of solder resists which are used for partly-additive printed wiring boards. We have discovered that emulsionized mixture of water-insoluble organic solvent in water can be used as a novel developer which has no ozone depletion potential. The developing characteristics, being comparable to that of trichloroethane, of this emulsionized developer are mainly attributed to the interfacial simultaneous action of water and the solvent. We have established a recycling process which consists of the salting-out techniques to efficiently recover the solvent from the waste. There are following merits of this developer; (1) lowered cost than trichloroethane, (2) suppressed toxicity, (3) no ozone depletion potential, and (4) lowered inflammability. Moreover, this developer can be used for the present resists without any change on the usual process and facilities in fabrication of printed wiring boards.

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