Cooling Unit for Computer Chip by using Boiling Heat Transfer

DOI
  • KAWAGUCHI Kiyoshi
    Mechanical and Intelligent Systems Engineering, Toyama University (3190 Gofuku, Toyama 930-8555)
  • TERAO Tadayoshi
    Department of Research & Development, DENSO Corporation (1-1 Showa-cho, Kariya, Aichi 448-8661)
  • KOBAYASHI Kazuo
    Department of Research & Development, DENSO Corporation (1-1 Showa-cho, Kariya, Aichi 448-8661)

Bibliographic Information

Other Title
  • 沸騰冷却を用いたコンピュータチップ用冷却器

Abstract

In recent years, the heating value of CPU has been increasing rapidly in proportion to the improvement of computer performance. Therefore computer industry is requiring the new cooling unit having high cooling performance for CPU adaptable to high heating value and high heat flux. In the past the cooling unit for CPU is used with air-cooling aluminum fin, but it can not be adaptable to high heating value. We have developed a new compact boiling refrigerant type cooling unit for CPU having high cooling performance in comparing with air-cooling aluminum fin. This paper described the cooling performance and pressure drop characteristics of the boiling refrigerant type cooling unit for CPU. The characteristics were clarified by testing the cooling unit under various test conditions, which were different Reynolds number, various sizes of cooling unit and various inclination angles. Furthermore the equations to predict cooling performance and pressure drop which are necessary on design of the cooling unit were proposed.

Journal

Keywords

Details 詳細情報について

  • CRID
    1390001204667284992
  • NII Article ID
    130004566043
  • DOI
    10.11322/tjsrae.21.309
  • COI
    1:CAS:528:DC%2BD2MXislKqt7o%3D
  • ISSN
    2185789X
    13444905
  • Text Lang
    ja
  • Data Source
    • JaLC
    • CiNii Articles
  • Abstract License Flag
    Disallowed

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