Development of Micro Channel Heat Exchanging

DOI Web Site Web Site BIBCODE 被引用文献3件 参考文献16件

この論文をさがす

抄録

In order to investigate the performance of the micro channel heat exchanger, three-dimensional numerical simulations and experiments on heat transfer behavior and pressure loss were carried out. So far as the heat transfer phenomena is concerned, results obtained using a silicon chip micro channel model showed a very small thermal resistance, about 0.1 (Kcm2/W). And, measured pressure loss showed good agreement with that of analytical result obtained on the basis of fully developed laminar pipe flow assumption. Furthermore, a practical setup was made with a micro channel heat exchanger to clarify the possibility of using the micro channel heat exchanger in electrical equipment. As a result, it was confirmed that the performance of the micro channel heat exchanger system is sufficient to cool a silicon chip which generates a large amount of heat, and the scale of the system is compact compared to that of the whole setup of electrical equipment.

収録刊行物

被引用文献 (3)*注記

もっと見る

参考文献 (16)*注記

もっと見る

キーワード

詳細情報 詳細情報について

問題の指摘

ページトップへ