Study on Hot Machining of Brittle Materials.
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- NAGATA Norio
- 学生会員千葉大学大学院
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- MORITA Noboru
- 正会員千葉大学工学部
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- YOSHIDA Yoshitaro
- 正会員千葉大学工学部
Bibliographic Information
- Other Title
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- 硬ぜい材料の高温切削に関する研究
- コウゼイ ザイリョウ ノ コウオン セッサク ニ カンスル ケンキュウ
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Abstract
This paper describes the mechanism of brittle-ductile transition of monocrystal silicon at a high temperature and its feasibility for ductile mode cutting. The micro-cutting tests were carried out at various temperatures, and for various cutting speeds and depth of cut by using a newly developed cutting device. The critical depth of cut is closely related to the material temperature and cutting speed. When the material temperature is 973K at a cutting speed of 1mm/s, the critical depth of cut is about two times that at room temperature. The critical depth of cut decreases with increasing in cutting speed. The specific cutting force is nearly constant at various temperatures. The residual stress on the ductile-mode cutting surface is compressive about 200MPa.
Journal
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- Journal of the Japan Society for Precision Engineering
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Journal of the Japan Society for Precision Engineering 64 (12), 1831-1835, 1998
The Japan Society for Precision Engineering
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Keywords
Details 詳細情報について
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- CRID
- 1390001204765743872
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- NII Article ID
- 110001372354
- 10010080364
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- NII Book ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL BIB ID
- 4620810
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed