書誌事項
- タイトル別名
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- Dynamical Study on ID-Blade Slicing Utilizing Elliptical Vibration. Mechanism of Elliptical Vibration Slicing and Behavior of Slicing Force.
- ダエン シンドウ オ リヨウ シタ ナイシュウバ スライシング ニ カンスル リキガクテキ ケンキュウ ダエン シンドウ スライシング ノ カコウ メカニズム ト セツダン テイコウ ノ キョドウ ニ ツイテ
- Mechanism of Elliptical Vibration Slicing and Behavior of Slicing Force
- 楕円振動スライシングの加工メカニズムと切断抵抗の挙動について
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抄録
ID-Blade sawing is widely used as the slicing method for the semiconductor materials represented the silicon ingot. At present, the size (diameter) of silicon ingot tends to increase, and for example, it changes the slicing method to the multi wire sawing used loose abrasive grains. However, it can be throught that the demand for the ID-Blade sawing is still continuing because of the high precision slicing in this method. This study aims to establish the vibration ID-Blade slicing technique utilizing the elliptical vibration in X-Y plane to improve the slicing efficiency and accuracy furthermore. In this paper, the slicing mechanism of elliptical vibration ID-Blade sawing for the dynamical consideration and the effect of the elliptical vibration on the slicing force are described. As the results, the elliptical vibration slicing can be brought out the decreasing of the slicing force from both theoretical and experimental considerations.
収録刊行物
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- 精密工学会誌
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精密工学会誌 65 (11), 1605-1610, 1999
公益社団法人 精密工学会
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詳細情報 詳細情報について
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- CRID
- 1390001204765904000
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- NII論文ID
- 110001372563
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- NII書誌ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL書誌ID
- 4988837
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可