Low Temperature Growth of Polycrystalline Silicon Films by RF Sputtering Method(1st Report).
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- KAKIUCHI Hiroaki
- 正会員 大阪大学大学院工学研究科
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- KAWABE Hideaki
- 正会員 大阪職業能力開発短期大学校
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- YOSHII Kumayasu
- 正会員 大阪大学大学院工学研究科
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- YASUTAKE Kiyoshi
- 正会員 大阪大学大学院工学研究科
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- TAKEUCHI Akihiro
- 正会員 大阪大学大学院工学研究科
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- HIROSE Kikuji
- 正会員 大阪大学大学院工学研究科
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- MORI Yuzo
- 正会員 大阪大学大学院工学研究科
Bibliographic Information
- Other Title
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- 高周波スパッタ蒸着法による多結晶Siの低温成膜に関する研究 (第1報)
- コウシュウハ スパッタ ジョウチャクホウ ニ ヨル タケッショウ Si ノ テ
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Abstract
In order to make polycrystalline silicon films at low temperature, hydrogen radicals have been utilized in the rf sputtering process. The films were prepared in gas mixtures containing argon and hydrogen. They were investigated by reflection electron diffraction and Raman spectroscopy. Furthermore, optical emission spectroscopy was employed to study the quantity of hydrogen radicals in the plasma, and the plasma potential was measured to decide the substrate bias voltage under realistic plasma condition for the deposition of silicon films. The results showed that polycrystalline silicon films were grown even at the substrate temperature of less than 200°C. It was also found from the optical emission spectroscopy that there existed atomic hydrogen radicals with high energy of about 10eV. They are expected to be able to restructure the silicon atoms on the substrate. Thus the crystallization at such low temperature is considered to be mainly due to hydrogen radicals in the plasma.
Journal
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- Journal of the Japan Society for Precision Engineering
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Journal of the Japan Society for Precision Engineering 61 (6), 829-833, 1995
The Japan Society for Precision Engineering
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Details 詳細情報について
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- CRID
- 1390001204765926272
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- NII Article ID
- 110001367571
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- NII Book ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL BIB ID
- 3613421
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed