書誌事項
- タイトル別名
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- Development of High-Definition Liquid Crystal Display Mounting System (2nd Report). Thermal Analysis of Bonding Tool for Liquid-Crystal Drive IC's.
- コウセイサイ エキショウ ディスプレイ ジッソウ システム ノ カイハツ ダイ2ホウ エキショウ クドウ IC ボンディングツール ノ ネツ カイセキ
- Thermal Analysis of Bonding Tool for Liquid-Crystal Drive IC's
- 液晶駆動ICボンディングツールの熟解析
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For higher definition and lower cost liquid crystal display, improvement of the mounting accuracy and productivity of liquid crystal driver IC in TCP (Tape Carrier Package) is essential.<BR>In order to mount several TCP's, which previously have been mounted one by one, at one time, temperature-homogenous long bonding tool is needed. The FEM (Finite Element Method) has been used until now for the thermal analysis of the long bonding tool. However, there was a big difference between an analytical and measured values. In order to solve this problem, an FVM (Finite Volume Method) is used, in which ambient air flow and thermal effects on adjacent parts are taken into consideration for heat and flow analysis, for leading to temperature-homogenous of bonding tool.
収録刊行物
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- 精密工学会誌
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精密工学会誌 67 (11), 1813-1817, 2001
公益社団法人 精密工学会
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詳細情報 詳細情報について
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- CRID
- 1390001204797175296
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- NII論文ID
- 110001373056
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- NII書誌ID
- AN1003250X
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- ISSN
- 1882675X
- 09120289
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- NDL書誌ID
- 5968756
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可