Effect of Cutting Point Swivel Machining by Using Tool with Special Chamfer

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  • 特殊チャンファ付き工具を用いた刃先移動加工法の効果
  • トクシュ チャンファ ツキ コウグ オ モチイタ ハサキ イドウ カコウホウ ノ コウカ

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Recently, in accordance with the technical development and miniaturization of the information equipments, the demand of optic elements with high precision and miniaturization is increased. The mold is used in the manufacture of the optic elements. Thus, it is needed to machine the mold with high efficiency and high precision. As the material of mold, hard material including cemented carbide and ceramics is used. However, it is a problem of the occurrence of severe tool wear when hard material is machined. To solve this problem, cutting point swivel machining by using the diamond tool with special chamfer was proposed, which has the ability to suppress tool wear and to realize ultraprecision machining. The effectiveness was verified by the microgrooving experiment of SiC. The study aims at investigating the effect of the cutting point swivel machining, and the cutting force and tool wear with different tool rotation speed. As a result, the effect of the cutting point swivel machining is made clear, and the relationship among tool rotation speed, cutting force and tool wear is known.

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