Cure Behavior of an Epoxy/ Anhydride System by Microdielectrometric Analysis

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  • 酸無水物によるエポキシ樹脂硬化物の誘電計測による硬化解析
  • サン ムスイブツ ニヨル エポキシ ジュシ コウカブツ ノ ユウデン ケイソク

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The curing of an epoxy / anhydride system was analyzed using microdielectrometry and differential scanning calorimetry. Microdielectric measurement may be available for collecting on-line real-time data during a casting process.<BR>The change of equivalent resistivity measured by microdielectrometry was investigated in connection with the extent of conversion and glass transition temperature obtained from the analysis of DSC. The curing temperature and time related to an equivalent resistivity could be described by Arrehenius law. The relation between the conversion and Tg was applied to the kinetics equation established by DiBenedetto. The equivalent resistivity (ρ) was proportional to the difference between a cure temperature (Tc) and Tg, and applicable the equation ρ=ρ0exp [A/fg + a (Tc-Tg)] that was introduced by a free volume analysis.

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