Improvement of Adhesive Property of Diallyl Phthalate Resin Modified with Dimeric Acid Polyamide

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  • ダイマー酸ポリアミドで変性したジアリルフタレート樹脂の接着性向上
  • ダイマーサン ポリアミド デ ヘンセイシタ ジアリルフタレート ジュシ ノ セッチャクセイ コウジョウ

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Dimeric acid polyamides (PA) were synthesized by the reaction of dimeric acid with m-xylylenediamine or diethylenetriamine. PA were added to a diallyl phthalate resin (DAP) to a concentration of 0.026mo1 to improve the adhesive properties. These blends were cured with dicumyl peroxide. The T-peel adhesive strength of the modified diallyl phthalate resin was markedly improved compared with that of diallyl phthalate resin. By modification with PA, the T-peel adhesive strength to copper increased up to about 2.0 times that of the diallyl phthalate resin. It is thought that the reason for this result is that flexibility was given to the adhesive layer by modifying PA concluding the dimeric acid unit. Moreover, it was revealed from FTIR analysis that adhesive strength to copper was improved because amide groups of PA were concentrated in the interface of copper substrate. Dynamic viscoelastic behavior and SEM showed that the diallyl phthalate resin modified with PA formed phase separated structure.

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