Control of the Morphology and Property of Acrylic Rubber/Epoxy Resin Adhesive Film by Reaction-Induced Phase Decomposition

DOI Web Site 3 Citations
  • MIYAUCHI Kazuhiro
    Joint Research Center for the Nanostructure Polymer Project, Japan Chemical Innovation Institute;Advanced Materials R&D Center
  • IWAKURA Tetsuro
    Joint Research Center for the Nanostructure Polymer Project, Japan Chemical Innovation Institute;Electric Materials R&D Center, Hitachi Chemical Co. Ltd.
  • INOUE Takashi
    Department of Polymer Science & Engineering, Yamagata University

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Other Title
  • 反応誘起相分解によるアクリルゴム/エポキシ樹脂系フィルムの相分離構造の制御とその物性
  • ハンノウ ユウキソウ ブンカイ ニ ヨル アクリルゴム エポキシ ジュシケイ フィルム ノ ソウブンリ コウゾウ ノ セイギョ ト ソノ ブッセイ

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Semiconductor packages have been continuously modified to allow higher integration and miniaturization to meet multifunctions, quicker response, and portability. Die stacking has been introduced into semiconductor packages for mobile phones. Die-bonding adhesive films for stacked chip size packages (stacked CSPs) are required to have high thermal-stress resistance and good retention of adhesive properties for high reliability. To develop the die-bonding films with such performance and reliability, we tried to control their morphology via the reaction-induced phase decomposition in acrylic rubber/epoxy resin systems by selecting their curing agents. As a result of the morphology control, we yielded an opaque film with ca. 2μm. domains which were observed by an optical microscope, showing good adhesion properties and expecting to potentially meet stacked CSP application. We also yielded a transparent film, showing high fracture strength. The carbonyl stretching band of the latter film was proved, by FT-IR analysis, to have shifted to lower wavenumbers. This result may indicate that the intermolecular interactions due to carbonyl groups prevent the miscible acrylic rubber/epoxy resin blend from undergoing phase decomposition.

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