Use of Steel Grinding Chips as Conductive Filler for Epoxy Resin

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  • エポキシ樹脂充填剤としての研磨粉に関する研究
  • エポキシ樹脂充填剤としての研磨粉に関する研究(第2報)エポキシ硬化物の電気抵抗の熱安定性と温度特性
  • エポキシ ジュシ ジュウテンザイ ト シテ ノ ケンマフン ニ カンスル ケンキュウ ダイ2ホウ エポキシ コウカブツ ノ デンキ テイコウ ノ ネツ アンテイセイ ト オンド トクセイ
  • Part 2 Heat Stability and Thermal Coefficient of Electrical Resistance
  • 第2報エポキシ硬化物の電気抵抗の熱安定性と温度特性

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Epoxy resin composites containing steel grinding chips as conducting filler were subjected to heat cycling tests in order to evaluate the thermal stability of electrical resistance. The effect of the content of grinding chips, magnetization and precure temperature in the curing process was examined, and this resulted in finding the thermal stability to depend mainly on the precure temperature : the higher the precure temperature, the higher was the thermal stability. There was also shown to be a minimum value in the electrical resistance of the composites at the temperature between 50 and 100°C. The ratio to the minimum resistance was found to depend mainly on the precure temperature. It has therefore been clarified that the thermal coefficient of the electrical resistance in the epoxy composites can be controlled by adjusting the precure temperature in the curing process.

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