Vernier ring based pre-bond through silicon vias test in 3D ICs
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- Ni Tianming
- School of Electronic Science & Applied Physics, Hefei University of Technology
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- Nie Mu
- School of Computer and Information, Hefei University of Technology
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- Liang Huaguo
- School of Electronic Science & Applied Physics, Hefei University of Technology School of Computer and Information, Hefei University of Technology
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- Bian Jingchang
- School of Electronic Science & Applied Physics, Hefei University of Technology
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- Xu Xiumin
- School of Electronic Science & Applied Physics, Hefei University of Technology
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- Fang Xiangsheng
- School of Computer and Information, Hefei University of Technology Department of Information Project, Anhui Institute of Economic Management
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- Huang Zhengfeng
- School of Electronic Science & Applied Physics, Hefei University of Technology
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- Wen Xiaoqing
- Department of Creative Informatics, Kyushu Institute of Technology
抄録
<p>Defects in TSV will lead to variations in the propagation delay of the net connected to the faulty TSV. A non-invasive Vernier Ring based method for TSV pre-bond testing is proposed to detect resistive open and leakage faults. TSVs are used as capacitive loads of their driving gates, then time interval compared with the fault-free TSVs will be detected. The time interval can be detected with picosecond level resolution, and digitized into a digital code to compare with an expected value of fault-free. Experiments on fault detection are presented through HSPICE simulations using realistic models for a 45 nm CMOS technology. The results show the effectiveness in the detection of time interval 10 ps, resistive open defects 0.2 kΩ above and equivalent leakage resistance less than 18 MΩ. Compared with existing methods, detection precision, area overhead, and test time are effectively improved, furthermore, the fault degree can be digitalized into digital code.</p>
収録刊行物
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- IEICE Electronics Express
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IEICE Electronics Express 14 (18), 20170590-20170590, 2017
一般社団法人 電子情報通信学会
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詳細情報 詳細情報について
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- CRID
- 1390001205220482944
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- NII論文ID
- 130006100017
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- ISSN
- 13492543
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- HANDLE
- 10228/00007524
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- 本文言語コード
- en
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- データソース種別
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- JaLC
- IRDB
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- 抄録ライセンスフラグ
- 使用不可