Tantalum Recovery from Printed Circuit Board by Heat Treatment

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Other Title
  • 熱処理によるプリント基板からのタンタル回収
  • ネツ ショリ ニ ヨル プリント キバン カラ ノ タンタル カイシュウ

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Abstract

In an attempt to recover tantalum from Printed Circuit board (PCB) , tantalum was concentrated by heat treatment and physical separation from mounted parts for PCB. Tantalum of PCBs is derived from tantalum capacitors. PCBs for personal computer (PC) and household appliance were crushed by water explosion to strip mounted parts from PCBs. More parts were stripped from PCB for PC composed of epoxy resin than from PCB for household appliance composed of phenol resin. Then, tantalum sintered bodies were separated from molded resins by heat treatment for tantalum capacitors at 723, 773K in the air and screening with 0.5mm sieve. 70% of tantalum grade was obtained after separation for tantalum capacitors. Tantalum recovery decreased under the condition of heat treatment at low oxygen concentration. Behavior of other parts by heat treatment was also investigated. While epoxy resin molding IC parts was powderized at over 723K, tantalum sintered body was powderized at over 823K. As a result, mounted parts of PCB for hard disk drive (HDD) were heated at 723K and the residue with size over 0.5mm was re-heated at 823K and screened. Material balances of tantalum, copper and precious metals were investigated on the process. 16% of tantalum grade and 71% of tantalum recovery was obtained. 13% of copper, 49% of gold, 12% of silver and 16% of palladium were distributed to the tantalum concentrated residue.

Journal

  • Journal of MMIJ

    Journal of MMIJ 127 (8), 519-525, 2011

    The Mining and Materials Processing Institute of Japan

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