Influence of Chloride Ions on Quality and Mechanical Properties of Electrodeposited Copper in Copper Electrorefining
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- SHIMOKAWA Kimihiro
- PAN PACIFIC COPPER Co. Ltd.
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- TETSUKA Daisuke
- PAN PACIFIC COPPER Co. Ltd.
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- SHIKADA Kei
- PAN PACIFIC COPPER Co. Ltd.
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- MURASE Kuniaki
- Department of Materials Science and Engineering, Kyoto University
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- SUGIMURA Hiroyuki
- Department of Materials Science and Engineering, Kyoto University
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- AWAKURA Yasuhiro
- Department of Materials Science and Engineering, Kyoto University
Bibliographic Information
- Other Title
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- 銅電解精製における電析銅の品質及び機械的性質に及ぼす塩化物イオンの影響
- ドウ デンカイ セイセイ ニ オケル デンセキドウ ノ ヒンシツ オヨビ キカイテキ セイシツ ニ オヨボス エンカブツ イオン ノ エイキョウ
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Abstract
The surface smoothness, S and Ag content of electrodeposited copper were investigated to clarify the influence of chloride ions on electrorefining using hydrochloric acid and SbCl3. The surface smoothness of electrodeposited copper was improved with increasing amounts of hydrochloric acid and SbCl3 as well as lower S and Ag content. The tensile strength and elongation of the electrodeposited copper were also studied to determine if they could be used as criteria for evaluating the cathode strippability in the permanent cathode process. The tensile strength and elongation increased when the total concentration of chloride ions released from hydrochloric acid and SbCl3 was 20 mg/L. Metallographic observations indicated that lower rate of twin crystal formation resulted in higher tensile strength and elongation at approximately 20 mg/L of chloride ion concentration.
Journal
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- Journal of MMIJ
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Journal of MMIJ 129 (2_3), 72-77, 2013
The Mining and Materials Processing Institute of Japan
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Details 詳細情報について
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- CRID
- 1390001205281944832
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- NII Article ID
- 10031141154
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- NII Book ID
- AA12188381
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- ISSN
- 18840450
- 18816118
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- NDL BIB ID
- 024278959
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- Text Lang
- en
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed