Anodizing of aluminum in sulfuric acid and oxalic acid solutions with percarboxylic acid-based additive

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  • YOSHIMOTO Mitsutaka
    Department of Materials Science and Engineering, Graduate School of Science and Technology, Kumamoto University
  • MORIZONO Yasuhiro
    Department of Materials Science and Engineering, Graduate School of Science and Technology, Kumamoto University
  • TSUREKAWA Sadahiro
    Department of Materials Science and Engineering, Graduate School of Science and Technology, Kumamoto University
  • BABA Tomoyuki
    Kumabou Metal Co., Ltd.

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Anodic oxidation of a pure Al plate was carried out in aqueous solutions containing sulfuric acid (H2SO4), oxalic acid (H2C2O4) and a percarboxylic acid-based additive at temperatures between 273 and 293 K for 0.6 to 9 ks under a constant current density of 300 A·m−2 (3 A·dm−2). The microstructures and the mechanical properties of the obtained anodic oxide film were investigated to determine the optimum electrochemical condition. In the H2SO4 + additive bath, the film with a maximum thickness of approximately 100 µm was formed at 293 K for 7.2 ks. However, the surface hardness of the film decreased with increasing processing time and film thickness. To enhance the film hardness, the Al plate was anodized in the H2SO4 + H2C2O4 + additive bath at lower temperatures, which resulted in higher Vickers hardness of 400–500 and excellent wear resistance for the thick film formed at 278 K for 7.2 ks. The film formed at 278 K in the H2SO4 + H2C2O4 + additive bath had a typical cell structure with a nano-sized pore at the center of each cell. Compared with the film formed in the H2SO4 bath, the cells were almost uniform in size and the pore size in the cell was smaller. In addition, the occupation ratio of the pores in unit area of the film formed in the H2SO4 + H2C2O4 + additive bath was smaller than that of the film formed in the H2SO4 bath. Such microstructural features are thought to be responsible for the high hardness of the anodic oxide thick film.

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