Microwave joining of alumina with alumina/zirconia insert under low pressure and high temperature

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  • KONDO Naoki
    National Institute of Advanced Industrial Science and Technology (AIST)
  • HOTTA Mikinori
    National Institute of Advanced Industrial Science and Technology (AIST)
  • HYUGA Hideki
    National Institute of Advanced Industrial Science and Technology (AIST)
  • HIRAO Kiyoshi
    National Institute of Advanced Industrial Science and Technology (AIST)
  • KITA Hideki
    National Institute of Advanced Industrial Science and Technology (AIST)

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Description

Joining of alumina with an alumina/zirconia insert by microwave heating was carried out at a low mechanical pressure of 0.17 MPa and high temperatures of 1650–1750°C. Joining occurred by diffusion bonding at 1650 and 1700°C, which are lower than the eutectic temperature of alumina/zirconia, and by liquid-phase assisted bonding at 1750°C, which is higher than the eutectic temperature of alumina/zirconia. Alumina joining under a low mechanical pressure and high temperature occurred successfully. Alumina joined at 1700 and 1750°C showed strengths of 310 and 212 MPa, respectively. Finally, joining by microwave local heating was demonstrated.

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