Advances and Challenges in 3D Physical Design

DOI Web Site 参考文献13件
  • Cong Jason
    Computer Science Department, University of California, Los Angeles California NanoSystems Institute
  • Luo Guojie
    Computer Science Department, University of California, Los Angeles

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The task of 3D physical design is to map a circuit from a netlist (structural) representation into a geometric (physical) representation according to a specific 3D IC technology with multiple active device layers. This paper discusses the recent progress made on the major steps in 3D physical design, including 3D floorplanning, 3D placement, 3D routing and thermal through-silicon via (TS via) planning, and outlines the challenges ahead.

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