Shrinkage and Internal Stress during Curing of Epoxide Resins

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  • エポキシ樹脂の硬化収縮と内部応力
  • エポキシ ジュシ ノ コウカ シュウシュク ト ナイブ オウリョク

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The shrinkage and internal stress of bisphenol type epoxide resins cured with aliphatic α, ω-diamines H2N-(CH2)m'-NH2 (m'=2, 4, 6 and 12) were investigated by measuring the density change and photoelasticity in the curing and the cooling processes.<br>The internal stress of these systems were caused by the shrinkage occuring in the cooling process from the glass transition temperature (Tg) to room temperature. The shrinkage and internal stress increased with an increase in crosslinking density and Tg of the cured systems, and with a decrease in m' of the curing agents.<br>From the above observations, it was suggested that the reductions in crosslinking density and Tg were necessary to reduce the shrinkage and internal stress caused by the curing.

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