銅の引張変形中の動的再結晶

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タイトル別名
  • Dynamic Recrystallization of Copper under Tensile Deformation
  • ドウ ノ ヒッパリ ヘンケイチュウ ノ ドウテキ サイケッショウ

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Dynamic recrystallization phenomenon in the tensile deformation of copper was investigated in order to clarify the deformation and the metallographic conditions under which the dynamic recrystallization appears. Cold-rolled specimens were tensiled preliminarily at various temperatures and a strain rate of 4.2×10-4sec-1. The stress-strain curves obtained showed plural maxima of the stress at temperatures above 250°C at which the specimens had already recrystallized statically before the loading. Optical and electron microscopic observations, a hardness measurement, and an X-ray diffraction experiment were carried out for water-quenched specimens after an interruption of the tensile deformation. These results showed that the plural maxima were attributable to strain hardening and dynamic recrystallization which became predominant one after another. A series of experiments on the effect of deformation temperature, strain rate and initial grain size on dynamic recrystallization were carried out for fully annealed specimens, as a function of the strain at the first maximum of the stress, εm, in the stress-strain curves. In the present investigation, εm decreased with increasing temperature and decreasing initial grain size, while εm had a minimum at the strain rate of 4.2×10-5sec-1. Finally, Cu-0.064, 0.12 and 0.26wt.% Sn alloys were prepared, from a consideration that Sn atoms suppress the static recrystallization of Cu-rich solid solution. The dynamic recrystallization of Cu-Sn alloys was also suppressed much in comparison with pure copper. This tendency became prominent with an increase in the amount of Sn.<br>The results obtained in the present study were discussed in reference to the dependence of deformation and metallographic conditions on the static recrystallization during the isothermal annealing.

収録刊行物

  • 材料

    材料 29 (323), 776-781, 1980

    公益社団法人 日本材料学会

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