Wood and Wood Based Materials. Low-Density Particleboards with Enhanced Particle Bond Network in the Thickness Direction. Basic Properties and Their Improvement by Veneer-Overlay.
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- SEKINO Noboru
- Dept. of Environmental Sci., Iwate Univ.
Bibliographic Information
- Other Title
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- 木質材料 厚さ方向の小片結合ネットワークを強化した低密度パーティクルボード 基礎物性および単板オーバーレイによるその補強
- アツサ ホウコウ ノ ショウヘン ケツゴウ ネットワーク オ キョウカ シタ テイミツド パーティクルボード キソ ブッセイ オヨビ タンパン オーバーレイ ニ ヨル ソノ ホキョウ
- Basic Properties and Their Improvement by Veneer-Overlay
- 基礎物性および単板オーバーレイによるその補強
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Abstract
To improve mechanical properties and dimensional stabilities of low-density particleboards, a new mat forming and pressing technique was applied. An extruded mat which consists of splint-shape particles (2mm by 2mm by 50mm) was rotated by right angle and then pressed flat with the movement of all mat sides constrained. Particleboards with a density ranging 0.2-0.5g/cm3 and with isocyanate resin as binder were manufactured both in the above method (E-board) and a conventional method (C-board). E-boards showed the constructive characteristics such as more enhanced particle bond network and less particle compressive strain in the panel thickness direction than C-boards, in addition to the strong orientation to one axis on the panel plane. As a result, E-boards exhibited much smaller thickness swelling (TS) and higher residual internal bond strength after boiling than C-boards, and were given better bending properties, inter-lamina shear strength and dimensional stability (linear expansion; LE) along the axis particles oriented on the panel plane. Veneer overlaying improved bending properties and LE in the direction perpendicular to it, which provided E-boards with those basic properties equal or better than C-boards, keeping much less TS than C-boards. Furthermore, cross-lapped two-layer veneer overlaying was found to provide E-boards with better bending properties than C-boards.
Journal
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- Journal of the Society of Materials Science, Japan
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Journal of the Society of Materials Science, Japan 51 (4), 386-391, 2002
The Society of Materials Science, Japan
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Details 詳細情報について
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- CRID
- 1390001205393106304
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- NII Article ID
- 110002301888
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- NII Book ID
- AN00096175
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- ISSN
- 18807488
- 05145163
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- NDL BIB ID
- 6138390
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- Abstract License Flag
- Disallowed