書誌事項
- タイトル別名
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- Development of Metalizing Technologies for Electronic Ceramics. II. Residual Stress Characteristics of Thermal Sprayed Aluminum Coatings.
- アルミニウム ヨウシャ ヒマク ノ ザンリュウ オウリョク トクセイ
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The thermal spraying process is widely used to the metalizing of electronic ceramic for forming the electric conductor and/or the under layer for bonding. However, residual stress characteristics of thermal sprayed coatings, which have an important effect on the adherent strength, have not always been clarified.<br>Thermal and mechanical properties were measured for two kinds of thermal sprayed aluminum coatings, which were formed by an atmospheric plasma spraying (APS) process and an electric arc spraying (EAS) process for investigating the characteristics of residual stress. It was confirmed by the X-ray diffraction technique that the residual stress of sprayed aluminum coatings over zinc-oxide substrate was always compressive in no relation to the spraying process and coating thickness. It was found that the compressive residual stress of sprayed aluminum coatings was induced by the low thermal conduction effect of zinc-oxide substrate.
収録刊行物
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- 材料
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材料 49 (1), 56-60, 2000
公益社団法人 日本材料学会
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キーワード
詳細情報 詳細情報について
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- CRID
- 1390001205393847040
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- NII論文ID
- 110002293885
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- NII書誌ID
- AN00096175
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- ISSN
- 18807488
- 05145163
- http://id.crossref.org/issn/05145163
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- NDL書誌ID
- 4965522
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- 本文言語コード
- ja
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- データソース種別
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- JaLC
- NDL
- Crossref
- CiNii Articles
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- 抄録ライセンスフラグ
- 使用不可