Flip-Chip Bonding Technologies with Low Melting Point Solders

DOI Web Site Web Site 2 Citations 37 References
  • YAMANAKA Kimihiro
    Chukyo University, School of Information Science and Technology, School of Information System Technology

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Other Title
  • 低融点はんだを用いたフリップチップ接合技術
  • テイユウテンハンダ オ モチイタ フリップチップ セツゴウ ギジュツ

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  • Journal of Smart Processing

    Journal of Smart Processing 1 (3), 114-119, 2012-05-20

    Smart Processing Society for Materials, Environment & Energy (High Temperature Society of Japan)

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