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- KOMIYA Gen
- Power and Industrial Systems R&D Center, Toshiba Corporation
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- MATSUZAKI Hidehito
- Power and Industrial Systems R&D Center, Toshiba Corporation
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- SEKIYA Hiroki
- Power and Industrial Systems R&D Center, Toshiba Corporation
Bibliographic Information
- Other Title
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- <b>シアネート硬化エポキシ樹脂を用いた高熱伝導材料の開発 </b>
- シアネート硬化エポキシ樹脂を用いた高熱伝導材料の開発
- シアネート コウカ エポキシ ジュシ オ モチイタ コウネツ デンドウ ザイリョウ ノ カイハツ
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Abstract
In recent years, due to the high density of the power semiconductor devices, heat dissipation and high heat resistance properties are required for the sealing epoxy resin. In this paper, we have developed with the aim of both high glass transition temperature and high thermal conductivity of the sealing epoxy resin. It was possible that a glass transition temperature of the epoxy resin (DGEBA) cured with cyanate (BADCY) had over than 200℃ by considering the ratio of the DGEBA/BADCY. Moreover, it was possible to improve 7W/(m・K) or more the thermal conductivity by filling Al2O3 and BN filler.
Journal
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- Journal of Network Polymer,Japan
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Journal of Network Polymer,Japan 35 (2), 58-64, 2014
Japan Thermosetting Plastics Industry Association
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Details 詳細情報について
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- CRID
- 1390001205459729408
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- NII Article ID
- 130004728028
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- NII Book ID
- AN10521608
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- ISSN
- 2186537X
- 13420577
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- NDL BIB ID
- 025374918
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- Text Lang
- ja
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- Data Source
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- JaLC
- NDL
- CiNii Articles
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- Abstract License Flag
- Disallowed